High pressure lid seal clip apparatus
US5716493A · kind A · utility
4Cited by
7References
30Claims
0Family size
Inventors
Key dates
| Filing date | Oct 4, 1995 |
| Grant date | Feb 10, 1998 |
| Priority date | — |
| Expiry date | Oct 4, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/18
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A lid is sealed to an integrated circuit package using a spring biased pressure foot that is structurally carried by a secondary loading jig to impose sealant curing load on the lid. The secondary jig attaches to the fabrication boat at a position indexed to apply optimal assembly force at the package center normal of the package lid plane.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.