Patent · US Expired

High-precision stepped microstructure bodies

US5716741A · kind A · utility

12Cited by
4References
7Claims
0Family size

Assignee

Inventors

Key dates

Filing dateApr 2, 1996
Grant dateFeb 10, 1998
Priority date
Expiry dateApr 2, 2016

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG03F7/0035
  • WIPO fieldOptics
  • WIPO sectorInstruments

Abstract

The present invention concerns stepped mould inserts, a method of producing the same and high-precision stepped microstructure bodies moulded therewith. The present stepped mould inserts and method of producing the same are more simple than previous methods. The lithographically produced regions of a patterned resist layer, which are exposed by development on a flat plate, are filled with metal. The layer may be mechanically removed, down to a predetermined thickness. After the residues of the resist have been dissolved out, if necessary or desired, this operation is repeated from one to several times. The regions removed from the resist layer are filled with metal, covered and separated from the resist layer, thus providing a multistep metallic mould insert. High-precision microstructure bodies having a multistep structure are produced with the present stepped mould insert.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.