High-precision stepped microstructure bodies
US5716741A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 2, 1996 |
| Grant date | Feb 10, 1998 |
| Priority date | — |
| Expiry date | Apr 2, 2016 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/0035
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The present invention concerns stepped mould inserts, a method of producing the same and high-precision stepped microstructure bodies moulded therewith. The present stepped mould inserts and method of producing the same are more simple than previous methods. The lithographically produced regions of a patterned resist layer, which are exposed by development on a flat plate, are filled with metal. The layer may be mechanically removed, down to a predetermined thickness. After the residues of the resist have been dissolved out, if necessary or desired, this operation is repeated from one to several times. The regions removed from the resist layer are filled with metal, covered and separated from the resist layer, thus providing a multistep metallic mould insert. High-precision microstructure bodies having a multistep structure are produced with the present stepped mould insert.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.