Method and apparatus for producing integrated circuit devices
US5716759A · kind A · utility
89Cited by
34References
26Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 17, 1996 |
| Grant date | Feb 10, 1998 |
| Priority date | — |
| Expiry date | Jun 17, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/944
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method for three dimensional lithography including the steps of providing a substrate (44) having surfaces extending in three dimensions and a light sensitive coating and illuminating the substrate via a mask (40) with light impinging on the surfaces at a non-perpendicular angle with respect thereto.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.