Laser-inscribable polymer moulding compositions
US5717018A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 12, 1996 |
| Grant date | Feb 10, 1998 |
| Priority date | — |
| Expiry date | Sep 12, 2016 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41M5/267
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A thermoplastic molding composition, containing PA0 A) 99.95 to 30 parts by weight of thermoplastic polymer, PA0 B) 0 to 3 parts by weight of copper pyrophosphate hydrate, PA0 C) 0 to 3 parts by weight of copper(II) hydroxide phosphate, PA0 D) 0 to 3 parts by weight of manganese sulphate hydrate, PA0 E) 0 to 50 parts by weight of fillers and reinforcing materials, PA0 F) 0 to 60 parts by weight of flame retardant additives, PA0 G) 0 to 30 parts by weight of elastomeric modifiers, PA0 H) 0 to 8 parts by weight of antimony trioxide, wherein at least one of the components B) or D) is contained in the mixture.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.