Solder-ball connected semiconductor device with a recessed chip mounting area
US5717252A · kind A · utility
93Cited by
10References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 2, 1996 |
| Grant date | Feb 10, 1998 |
| Priority date | — |
| Expiry date | Dec 2, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device which remains highly reliable and is easy to mount even when a bonding pad pitch is reduced. The semiconductor device is featured in that a thermally conductive support substrate in which a semiconductor chip is fixed to a recessed portion is mounted on the reverse side of an insulating tape, that is, a TAB substrate having a conductor pattern on the surface; and solder balls are placed on the front side of the insulating tape to ensure connection to the conductor pattern on the front side through holes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.