Assembly of printing devices using thermo-compressive welding
US5718044A · kind A · utility
15Cited by
25References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 28, 1995 |
| Grant date | Feb 17, 1998 |
| Priority date | — |
| Expiry date | Nov 28, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49401
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Components of the printing device are attached by a process employing thermo-compressive welding. The process results in a unitary, graded interface between the attached components and eliminates the need for applying thermal-cure adhesives to secure the components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.