Patent · US Expired

Apparatus and method for spray-cooling an electronic module

US5718117A · kind A · utility

70Cited by

43References

18Claims

0Family size

Assignee

Motorola, Inc. · US

Inventors

Kevin J. McDunn · Lake in the Hills, US
Linda Limper-Brenner · Glenview, US
Minoo D. Press · Schaumburg, US

Key dates

Filing date	Apr 10, 1996
Grant date	Feb 17, 1998
Priority date	—
Expiry date	Apr 10, 2016

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10S165/908
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

The apparatus includes a plate (10) having a first layer (12) and a second layer (14) opposed to the first layer (12). A first fluid distributing conduit (28) is disposed in the first layer (12) and a second fluid distributing conduit (28) is disposed in the second layer (14). A first nozzle housing (30) having a first aperture (36) is disposed in the first fluid distributing conduit (28) and a second nozzle housing (30) having a second aperture (36) is disposed in the second fluid distributing conduit (28).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.