Heat transfer device of a plate stack construction
US5718286A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 1, 1996 |
| Grant date | Feb 17, 1998 |
| Priority date | — |
| Expiry date | Aug 1, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S165/363
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A plate sandwich structure for a heat transfer device provides flow duct plate units alternately stacked upon one another having flow duct breakthroughs which extend between two lateral plate areas as well as with connection duct breakthroughs, which are arranged separately from the flow duct breakthroughs, and connection cover plate units having connection duct breakthroughs arranged at least in two lateral plate areas. The last named breakthroughs suitably overlap with equal-sided ends in a flow duct breakthrough of one adjoining lateral plate area as well as a connection duct breakthrough of a flow duct plate unit adjoining the other lateral plate area. This results in two separate flow duct systems which are capable of passing two fluids in a cross current, reverse current or direct current. The structure can be used, for example, as a high temperature battery cooling element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.