Electroless plating bath for forming black coatings and process for forming the coatings
US5718745A · kind A · utility
25Cited by
3References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 7, 1996 |
| Grant date | Feb 17, 1998 |
| Priority date | — |
| Expiry date | Aug 7, 2016 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C18/34
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An electroless plating bath for forming black coatings containing a nickel salt and a reducing agent, which further contains a sulfur-containing compound, zinc ions and optionally microparticles, and a method for forming black coatings by electroless plating, wherein an article to be plated is immersed in the plating bath for a certain period of time, which provide black plated coatings without any post-treatments for blackening. Also provided is an article having an electrolessly plated black coating formed by the method.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.