Apparatus for coating a substrate from an electrically conductive target
US5718815A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 12, 1996 |
| Grant date | Feb 17, 1998 |
| Priority date | — |
| Expiry date | Sep 12, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/0206
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A vacuum chamber includes a central compartment (1) in which a diode cathode (6) carrying an electrically conductive sputtering target (7) is located, and two outer compartments (11, 12) in which magnetron cathodes (13, 14) carrying target 15, 16) are located, the magnetron cathodes (13, 14) being connected to respective poles (20, 21) of an AC power source. The outer compartments (11, 12) are separated from the central compartment by walls having openings (33, 34) which flank a space (28) between the sputtering target (6) and the substrate (3). Process gas lines 24, 25) are arranged to introduce process gas into this space (3).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.