Lead-free tin-zinc-based soldering alloy
US5718868A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 30, 1996 |
| Grant date | Feb 17, 1998 |
| Priority date | — |
| Expiry date | Jul 30, 2016 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K35/262
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Described is a lead-free tin-zinc-based soldering alloy made up of 7 to 9 wt. % of Zn and 0.1 to 0.5 wt. % of Cu or which further contains not more than 3 wt. % of Bi and, in either case, the balance being Sn except for inevitable impurities. The present invention has made it possible to provide a lead-free soldering alloy which has mechanical properties, such as tensile strength and elongation, comparable with those of conventional Pb--Sn soldering alloys without adding thereto lead which causes environmental pollution, has a melting point not higher than 200.degree. C., which is lower than the heat-resistant temperature of an IC package, and has a low cost.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.