Patent · US Expired

Polyamide based on dimer fatty acid

US5719255A · kind A · utility

29Cited by

3References

24Claims

0Family size

Assignee

Henkel Kommanditgesellschaft auf Aktien · DE

Inventors

Reimar Heucher · Pulheim, DE
Bettina Becker · Monheim, DE
Angela Rossini · Marsala, IT

Key dates

Filing date	Sep 11, 1996
Grant date	Feb 17, 1998
Priority date	—
Expiry date	Sep 11, 2016

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC09K2200/0667
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

A composition of matter useful as a hotmelt adhesive is provided. The adhesive comprises a polyamide based on dimerized fatty acid, preferably having an amine value of less than 2, and at least one heat stabilizer for polyvinyl chloride, preferably selected from the group consisting of alkyl tin carboxylate compounds and epoxy compounds. The heat stabilizer is preferably present in an amount of 0.2% to 10.0% by weight of the composition. Also provided is a method of using the composition as a hotmelt adhesive for polyvinyl chloride.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.