Semiconductor component with integrated heat sink
US5719433A · kind A · utility
20Cited by
14References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 25, 1996 |
| Grant date | Feb 17, 1998 |
| Priority date | — |
| Expiry date | Jul 25, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor component that could be a power transistor type of component comprises mesa-structured elementary bipolar transistors. This component has a thick, metal heat sink of which a part (PI) takes the form of a bridge and a part is in contact with the substrate. The legs of the bridge lie on the entire unit constituted by the mesas. The heat sink made on the front face of the substrate may be connected to the rear face of the substrate comprising a ground plate. The discharging of the heat is thus appreciably fostered.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.