Smart cards having thin die
US5719437A · kind A · utility
7Cited by
5References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 19, 1996 |
| Grant date | Feb 17, 1998 |
| Priority date | — |
| Expiry date | Apr 19, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Thin semiconductor die, approximately 0.004 to 0.007 inches thick, are positioned substantially on the neutral plane of a smart card, the neutral plane defined as the plane of substantially no mechanical strain during flexure of the smart card, thereby providing smart cards having improved resistance to mechanical flexure, and/or smart cards having improved RF performance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.