Resin sealing type semiconductor device
US5719442A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Nov 13, 1995 |
| Grant date | Feb 17, 1998 |
| Priority date | — |
| Expiry date | Nov 13, 2015 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A resin sealing type semiconductor device includes an internal heat radiator having an element placing surface, a semiconductor element bonded to the element placing surface and leads which are separated from the semiconductor element. Wires electrically connect the leads to the electrodes of the semiconductor element. An insulator is located between the internal heat radiator and the leads. A resin package is formed exposing an exposed area of the internal heat radiator. A heat radiating fin is bonded to the exposed area of the internal heat radiator by a solder layer therebetween. The dimension S1 of the exposed area is equal to or larger than the dimension S2 of the bonding area of the heat radiating fin and the solder layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.