Thin film fabrication technique for implantable electrodes
US5720099A · kind A · utility
91Cited by
3References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 1, 1996 |
| Grant date | Feb 24, 1998 |
| Priority date | — |
| Expiry date | May 1, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49126
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
An elongated implantable electrode assembly includes a set of electrode pads arranged in a pre-selected pattern, and a plurality of longitudinal wires, each wire being connected to at least one pad. The electrode assembly is formed by first depositing the pads on a sacrificial layer, adding wires to the pad, embedding the pads and wires in a carrier and then removing the sacrificial layer. These steps can be performed using photolithographic techniques.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.