Multiple substrate
US5721044A · kind A · utility
3Cited by
2References
25Claims
0Family size
Inventors
Key dates
| Filing date | Feb 9, 1996 |
| Grant date | Feb 24, 1998 |
| Priority date | — |
| Expiry date | Feb 9, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24926
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multiple substrate is provided having a large area individual base layer with multiple substrates, for electrical circuits formed thereon. Individual substrates are defined by score lines in the base layer, and include a fragment of the base layer and at least one metal coating is provided on at least one surface of the fragment and has areas which stabilize the multiple substrates against unwanted breaking. Several individual substrates are preformed along peripheral sides of the base layer, and at least one metal coating on each individual substrate projects over the peripheral side.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.