Stable, low cure-temperature semi-structural pressure sensitive adhesive
US5721289A · kind A · utility
71Cited by
20References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 5, 1995 |
| Grant date | Feb 24, 1998 |
| Priority date | — |
| Expiry date | Oct 5, 2015 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J4/06
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A curable pressure sensitive adhesive having long shelf stability comprising (a) at least one free radically polymerized polymer; (2) at least one cationically-polymerizable monomer; (3) a photo-activatable catalyst system for the cationically-polymerizable monomer comprising either at least one organometallic complex salt or at least one onium salt; and (4) optionally, a monohydric or polyhydric alcohol, wherein there is essentially no conversion of the cationically-polymerizable monomer of the curable pressure sensitive adhesive when stored in a manner to exclude actinic radiation, and methods of making the same.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.