Integrated circuit package
US5721453A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 8, 1992 |
| Grant date | Feb 24, 1998 |
| Priority date | — |
| Expiry date | Jun 8, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/115
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An integrated circuit package comprises a power supply conductor film having a potential and conductor columns insulated from and passed through the power supply conductor film. A power supply conductor column comprises one of the conductor columns connected to a power supply having a potential different from the power supply conductor film. The other conductor columns are signal conductor columns for exchanging signals with mounted integrated circuits. An insulation space between the power supply conductor film and the power supply conductor column is greater than an insulation space between the power supply conductor film and a signal conductor column. Thereby, a probability of short-circuit occurrence in the power supply conductor film across the power supply conductor column is lowered.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.