Method and apparatus for transferring heat from transducer array of ultrasonic probe
US5721463A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Dec 29, 1995 |
| Grant date | Feb 24, 1998 |
| Priority date | — |
| Expiry date | Dec 29, 2015 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG10K11/004
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A device for improving thermal transfer inside an ultrasound probe and reducing heat build-up near the transducer face. The cable components are used as heat conductors which conduct heat out of the probe handle. These heat pipes are coupled to an internal heat conductor which is in heat conductive relationship with the transducer pallet. Thus, heat generated by the transducer array can be transferred, via the internal heat conductor plate and the cable heat conductors, away from the probe surface which contacts the patient. A heat conductive structure can be embedded in the overall shield braid of the cable. Suitable heat conductive structures include thread or wire made of material having a high coefficient of thermal conductivity, as well as narrow tubing filled with heat conductive fluid. Alternatively, inlet and return flow paths for cooling fluid are incorporated in the cable. The inlet and return flow paths inside the cable are respectively connected to the inlet and outlet of a flow path which is in heat conductive relationship with an internal heat conductor in the probe handle.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.