Multilayer wiring structure
US5723908A · kind A · utility
284Cited by
10References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 11, 1994 |
| Grant date | Mar 3, 1998 |
| Priority date | — |
| Expiry date | Mar 11, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/0298
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multilayer wiring structure comprising a substrate, two line layers, and an interlayer insulating film. The first line layer consists of strip-shaped power/ground lines which extend parallel to one another. The second line layer is located above or below the first line layer, extends substantially parallel to the first line layer. The second line layer consists of strip-shaped signal lines which extend parallel to one another and at an angle to the strip-shaped power/ground lines of the first line layer in a skewed position.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.