Method and apparatus for cooling of chips using a plurality of customized thermally conductive materials
US5724729A · kind A · utility
47Cited by
17References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 15, 1996 |
| Grant date | Mar 10, 1998 |
| Priority date | — |
| Expiry date | Apr 15, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49144
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention relates generally to a new apparatus and method for customized cooling of chips using a plurality of thermally conductive materials. More particularly, the invention encompasses an apparatus and a method that provides customized cooling of a MCM (Multi-Chip Module) by using a plurality of thermally conductive materials.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.