Integrated circuit with taped heat pipe
US5725050A · kind A · utility
16Cited by
16References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 3, 1996 |
| Grant date | Mar 10, 1998 |
| Priority date | — |
| Expiry date | Sep 3, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
The invention is an apparatus for attaching a heat pipe to an integrated circuit or other surface. The heat pipe is held against the flat surface by a heat conducting clamp constructed as a "U" cross section with flanges on the ends of the "U" section, and both the heat pipe and the clamp are held onto the integrated circuit or other surface with heat conductive tape which has adhesive on both its faces. The heat pipe itself can be deformed so that its contact surface also is flat and yields better heat transfer with the integrated circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.