Laser transfer deposition
US5725706A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 12, 1996 |
| Grant date | Mar 10, 1998 |
| Priority date | — |
| Expiry date | Mar 12, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/046
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention is directed to a method for producing a smooth and continuous pressure bonded layer of a material on a base substrate through the driving force of a pulsed laser. The method comprises the steps of selecting a laser absorptive material. Then applying thereto a thin layer of the material for pressure bonding to the base substrate. Next, placing the base substrate and the thin layer of material on the laser absorptive material in a vacuum, then placing the base substrate in close proximity to the thin layer of material. Finally, directing pulsed laser energy toward the laser absorptive material and the layer to be pressure bonded, whereby the laser energy is absorbed by the laser absorptive material causing heating and vaporization thereof to a controlled depth of the laser absorptive material, leaving remaining portions of the laser absorptive material unvaporized after the vaporization to act as a support for the material to be bonded. After bonding, the thin material adheres to the base substrate when the remaining continuous absorptive material is peeled away, the vaporization having provided the necessary pressure for pressure bonding on to the base material…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.