Apparatus and method for patterning a surface
US5725788A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 4, 1996 |
| Grant date | Mar 10, 1998 |
| Priority date | — |
| Expiry date | Mar 4, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/3081
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An apparatus (95) and method for patterning a surface of an article (30), the apparatus (95) including a large-area stamp (50) for forming a self-assembled monolayer (36) (SAM) of a molecular species (38) on the surface (34) of a layer (32) of resist material, which is formed on the surface of the article (30). The large-area stamp (50) includes a layer (52) of an elastomer and has, embedded within it, mechanical structures (68, 80) which stiffen the large-area stamp (50) and deform it to control the stamped patterns. The method includes the steps of: forming a layer (32) of resist material is on the surface of the article (30), utilizing the large-area stamp (50) to form the SAM (36) on the surface (34) of the layer (32) of resist material, etching the layer (32) of resist material, and thereafter etching or plating the surface of the article (30).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.