Heat sink having good heat dissipating characteristics
US5726495A · kind A · utility
44Cited by
14References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 9, 1993 |
| Grant date | Mar 10, 1998 |
| Priority date | — |
| Expiry date | Mar 9, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12639
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat sink comprising a bottom plate and a plurality of fin groups on the bottom plate is disclosed, the plurality of the groups being spaced from one another, and aligned in a matrix form or arranged in a staggered pattern, and each of the group comprising a plurality of plane parallel plates or pins that are integral with the bottom plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.