Temperature sensor with internal rigid substrate
US5726624A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 1, 1996 |
| Grant date | Mar 10, 1998 |
| Priority date | — |
| Expiry date | Jul 1, 2016 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01K7/183
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A temperature sensor is made with a rigid substrate disposed within a metallic tube for the purpose of supporting a resistive temperature detector and conductive strips disposed on the substrate. The conductive strips of palladium silver are deposited on the substrate and in electrical communication with gold pads that are used to permit the RTD to be connected to the gold pads by wire bonding techniques. A sleeve is provided at an opposite end of the sensor to support a first end region of the rigid substrate at a preselected position within the tube. The second end region of the substrate extends away from the sleeve and toward an opposite end of the tube, which is crimped to seal it. Conductive wires are avoided within the main portion of the outer metallic tube, thus eliminating the need for fiber glass sleeved wires extending through the tube.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.