Mold arragement
US5727615A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 15, 1995 |
| Grant date | Mar 17, 1998 |
| Priority date | — |
| Expiry date | Dec 15, 2015 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB22D11/053
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A mold arrangement for the production of endless castings of metal, particularly slabs of steel, having copper plates for the wide sides of the mold which rest on coolable support plates, and narrow sides which can be clamped between the wide sides. Additionally, an oscillating device is connected with the support plates. The support plates are trough-shaped in the region of the mold wide sides. Channels are provided in the wall of the support plates for the passage of a cooling fluid. Electromagnetic structural parts arranged on mounting frames can be freely introduced into the trough free space which faces away from the wide sides.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.