Thermoplastic polyamide molding materials

US5728800A · kind A · utility

Assignee

• BASF SE

Inventors

• Axel Gottschalk · Neustadt, DE
• Herbert Fisch · Monsheim, DE
• Gunter Pipper · Bad Dürkheim, DE
• Martin Weber · Maikammer, DE

Key dates

• Filing date: Jan 23, 1996
• Grant date: Mar 17, 1998
• Expiry date: Jan 23, 2016

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C08L33/10
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

Thermoplastic molding materials contain PA1 A) from 5 to 94% by weight of a partly aromatic, semicrystalline copolyamide composed essentially of PA2 a.sub.1) from 30 to 44 mol % of units which are derived from terephthalic acid, PA2 a.sub.2) from 6 to 20 mol % of units which are derived from isophthalic acid, PA2 a.sub.3) from 43 to 49.5 mol % of units which are derived from hexamethylenediamine, and PA2 a.sub.4) from 0.5 to 7 mol % of units which are derived from aliphatic cyclic diamines of 6 to 30 carbon atoms, the molar percentages of components a.sub.1) to a.sub.4) together giving 100% and PA1 B) from 5 to 94% by weight of an ASA or ABS or SAN polymer or of a C.sub.1 -C.sub.18 -alkyl ester of (meth)acrylic acid or of a mixture thereof, PA1 C) from 1 to 30% by weight of an adhesion promoter which contains from 0.1 to 10% by weight, based on 100% by weight of (C), of functional monomers, PA1 D) from 0 to 30% by weight of an elastomeric polymer, PA1 E) from 0 to 45% by weight of a fibrous or particulate filler or of a mixture thereof, and PA1 F) from 0 to 30% by weight of conventional additives and processing assistants, the percentages A) to F) summing to 100%.