Electronic component cooling unit
US5729995A · kind A · utility
50Cited by
17References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 19, 1996 |
| Grant date | Mar 24, 1998 |
| Priority date | — |
| Expiry date | Mar 19, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
In an electronic component cooling unit, parts of the outer surfaces of a plurality of passageways in which refrigerant flows are coupled to one surface of a cold plate on the other surface of which an electronic component is mounted, and a header tank is provided in the plurality of passageways so that a plurality of looped passageways are formed. The plurality of passageways are provided by a multi-flow-path container which is formed by extrusion molding and has a flattened cross section.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.