Patent · US Expired

Method of forming product having globular microstructure

US5730198A · kind A · utility

29Cited by
14References
10Claims
0Family size

Assignee

Inventor

Key dates

Filing dateJun 6, 1995
Grant dateMar 24, 1998
Priority date
Expiry dateJun 6, 2015

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10S164/90
  • WIPO fieldMaterials, metallurgy
  • WIPO sectorChemistry

Abstract

A temperature profile is determined of a metal sample for the metal to be converted to establish a temperature range indicative of a partially solid and partially liquid state of the metal. With this temperature profile, a metal preform is heated at a controlled rate from a temperature below the temperature range to a temperature within the range defined by the temperature profile to achieve a select percent by volume of liquid in the metal. This controlled heating to a desired temperature, which may be at a uniform rate, followed by holding at the desired temperature, thermally converts a dendritic structure of the material into a globular structure. The thermally converted metal preform is then recovered for subsequent use such as shaping into a desired article.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.