Heat sink having an assembling device
US5730210A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Feb 24, 1997 |
| Grant date | Mar 24, 1998 |
| Priority date | — |
| Expiry date | Feb 24, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat sink having an assembling device using mechanical characteristics of resilience or flexibility so as to effectively fasten a heat sink. In one embodiment, this invention comprises a chassis having a heat dissipating surface, a plurality of fastening holes formed on the chassis, and fastening bolts and helical springs corresponding to the fastening holes, wherein the fastening bolts each further comprise a mushroom-shaped insertion end. In another embodiment, the heat sink comprises a chassis having a heat dissipating surface and a fastening seat for fastening the heat sink, wherein the fastening seat is formed of a resiliently curvable and integrally formed sheet and is provided with a pair of hooks each having a V-shaped barb for inserting the invention into holes abutting the chip and pre-formed on a motherboard and for resiliently pressing the heat sink against the chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.