Electrically conducting connection
US5730543A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 2, 1996 |
| Grant date | Mar 24, 1998 |
| Priority date | — |
| Expiry date | Aug 2, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T403/477
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An electrically conductive connection is made between a metal connector and a metal layer applied and bonded by sintering to a ceramic substrate comprising glass and/or vitreous ceramic in small quantities. An adhesion-promoting layer having a glass and/or vitreous ceramic and metal particles is applied and bonded by fusion to the ceramic substrate. The metal layer with the sintered bond is then applied to the ceramic substrate and the connector is welded to the metal layer by laser welding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.