Ethylene, vinyl acetate and vinylalkoxysilane copolymer hot-melt adhesives
US5731384A · kind A · utility
2Cited by
1References
17Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 30, 1996 |
| Grant date | Mar 24, 1998 |
| Priority date | — |
| Expiry date | Sep 30, 2016 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2666/02
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The present invention relates to hot-melt adhesive compositions based on copolymers of ethylene, vinyl acetate and vinylalkoxysilane units, which are crosslinkable by moisture, wherein the hot-melt adhesive is substantially anhydrous. More particularly, it relates to the storage stability of the hot-melt adhesive compositions including at least one crosslinking catalyst. The invention also relates to a process for the manufacture of the hot-melt adhesive composition comprising drying the hot-melt adhesive under vacuum at a temperature lower than 180.degree. C. and purging with a dry gas at a temperature lower than 180.degree. C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.