Ultrasonic array with attenuating electrical interconnects

US5732706A · kind A · utility

Assignee

• Lockheed Martin IR Imaging Systems, Inc. · US

Inventors

• Timothy E. White · Acton, US
• Neal R. Butler · Acton, US
• Marcus Hatch · Waltham, US
• Kenneth R. Erikson · Laguna Woods, US
• Curtis A. Vock · Boulder, US
• Wayne C. Haase · Mountain View, US
• Michael A. Martinelli · Winchester, US

Key dates

• Filing date: Mar 22, 1996
• Grant date: Mar 31, 1998
• Expiry date: Mar 22, 2016

Classification

• Technology area (CPC A): Human Necessities
• CPC primary: A61B8/4281
• WIPO field: Medical technology
• WIPO sector: Instruments

Abstract

An array of ultrasonic transducers, where each of the ultrasonic transducers has a matching layer end and a driving layer/individually isolated end. A bump bond connects each one of the ultrasonic transducers to a substrate. A high voltage electrical conductor is connected to at least one driving layer/individually isolated end to provide a drive signal to at least one of the ultrasonic transducers. A conductive/matching layer is disposed to electrically connect each matching layer end. An outer matching layer is connected to the conductive/matching layer. The bump bond is an indium or solder bump bond having a contact area for contact with an ultrasonic transducer less than 20 percent of the driving layer/individually isolated end for the contacted ultrasonic transducer so as to provide mechanical stability while reducing cross talk among the plurality of ultrasonic transducers.