Flexible wiring board and its fabrication method
US5733598A · kind A · utility
15Cited by
12References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 10, 1997 |
| Grant date | Mar 31, 1998 |
| Priority date | — |
| Expiry date | Mar 10, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A flexible wiring board includes a printed conductive circuit layer formed on an insulating film, a metallic layer formed on the printed conductive circuit layer, and an insulating layer formed on the metallic layer. A method of making a flexible wiring board includes the steps of forming a conductive circuit layer by screen printing a wiring pattern using a conductive paste, baking the printed wiring pattern, and forming a metallic layer on the printed conductive circuit layer by a plating method.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.