Inter-level dielectrics with low dielectric constants
US5733606A · kind A · utility
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7Claims
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Key dates
| Filing date | Feb 28, 1997 |
| Grant date | Mar 31, 1998 |
| Priority date | — |
| Expiry date | Feb 28, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31663
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A metallization is coated with a network polymer. The network polymer may either a cross-linked polyfluorinated polyallylether-polyhydromethylsiloxane copolymer or a network polymer formed from cross-linked fluoromethylene cyanate ester monomers. These polymer networks are resistant to the diffusion of a metallization, such as copper, therethrough.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.