Method of making IC card
US5735040A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 19, 1996 |
| Grant date | Apr 7, 1998 |
| Priority date | — |
| Expiry date | Sep 19, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49171
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method of producing a thin IC card having a built-in battery includes forming a through-hole including an edge in a circuit board having obverse and reverse main surfaces, a circuit pattern being present on a first of the main surfaces of the circuit board; mounting a functional part on the first of the main surfaces of the circuit board; molding said circuit board and said functional part in a resin with a second main surface of said circuit exposed and forming a battery lodging section in the resin molding defined by the through-hole; and mounting a battery in said battery lodging section and electrically connecting the circuit pattern to the battery.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.