Heat sink with integral attachment mechanism
US5735340A · kind A · utility
10Cited by
2References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 15, 1996 |
| Grant date | Apr 7, 1998 |
| Priority date | — |
| Expiry date | May 15, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A thermally conductive heat sink unit having an integral attachment mechanism. In the present invention, a thermally conductive unit is adapted to thermally contact a heat generating device mounted on a substrate. A flexible connector is integral with the thermally conductive unit. The flexible connector is adapted to couple the thermally conductive unit to the substrate such that the thermally conductive unit thermally contacts the heat generating device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.