Dual chamber film applicator with in-pond overflow
US5735957A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 2, 1995 |
| Grant date | Apr 7, 1998 |
| Priority date | — |
| Expiry date | Oct 2, 2015 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB05C3/18
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An applicator head is positioned beneath a backing roll and has a housing divided into three sections. A first coating pond is defined between an overflow barrier and a first wall. A converging plate extends between the first wall and a second wall, and converges toward the substrate, and a second pond is defined between the plate and an end wall. Coating is introduced to both ponds. A low pressure cavity is defined beneath the converging plate and between the first wall and the second wall. The cavity opens to the second pond, and draws air and excess coating from the second pond. The substrate is prewetted as it passes through the first pond, and coating deprived of entrained air is applied to the substrate in the second pond. Coat weight uniformity and increased machine speeds are thus achievable.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.