Method of aperturing thin sheet materials
US5735984A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 23, 1996 |
| Grant date | Apr 7, 1998 |
| Priority date | — |
| Expiry date | Sep 23, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1082
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method of forming apertures generally greater than about 0.05 square millimeters in a thin sheet material. The thin sheet material includes a first side and a second side at least one side of the thin sheet material is substantially coated with an adhesive. The method comprises the steps of (a) placing the adhesive-coated thin sheet material on a patterned anvil having a pattern of raised areas wherein the height of the raised areas is equal to or less than the thickness of the thin sheet material and the adhesive; and (b) subjecting the thin sheet material to a sufficient amount of sonic vibrations to aperture the thin sheet material and the adhesive; and whereby the thin sheet material and the adhesive is apertured in a pattern generally the same as the pattern of raised areas on the patterned anvil.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.