Method of forming a layer of silica to be eliminated subsequently and method for mounting an integrated optical component
US5736429A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 1, 1995 |
| Grant date | Apr 7, 1998 |
| Priority date | — |
| Expiry date | Dec 1, 2015 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/975
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
In a method for mounting an integrated optical component, a starting base structure includes a silica lower confinement layer and the cores of the future optical waveguides. This basic structure includes an alignment abutment so that a component to be mounted can be subsequently aligned with these waveguides. A silicon barrier layer is deposited on the abutment. Flame hydrolysis deposition is then used to deposit an upper silica layer to constitute the upper confinement layer of the waveguides. This silica layer also covers the alignment abutment, however. For this reason the region of the abutment is then etched by reactive ion etching to expose the abutment, which is protected from this etching by the barrier layer. The component to be mounted is then located relative to the abutment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.