Moldings for packaging, and process for the production thereof
US5736585A · kind A · utility
1Cited by
3References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 27, 1997 |
| Grant date | Apr 7, 1998 |
| Priority date | — |
| Expiry date | Feb 27, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S264/07
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
The application relates to polyethylene and/or polypropylene foam moldings for packaging which consist of more than 50% of recycled material, and to a process for the production thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.