Power module with silicon dice oriented for improved reliability
US5736786A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 1, 1996 |
| Grant date | Apr 7, 1998 |
| Priority date | — |
| Expiry date | Apr 1, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15787
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A power module has a metallic base plate layer and a substrate layer that has a first metallic layer, a dielectric layer, and a second metallic layer. A solder layer thermally and electrically connects the second metallic layer to the base plate. A plurality of silicon dice are mounted to the first metallic layer of the substrate. The solder layer has a void development region which after a predetermined number of thermal cycles does not significantly increase. The silicon dice are oriented on the substrate layer so that the silicon dice are not aligned over the void development region corresponding to the useful life of the module. The metallic base plate may also be mounted to a heatsink through a thermal grease layer. The heatsink may comprise the outer covering of the power module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.