Metallized film capacitor
US5737179A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 7, 1996 |
| Grant date | Apr 7, 1998 |
| Priority date | — |
| Expiry date | Feb 7, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G4/20
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Sheet capacitive materials for use in forming a thin-film capacitor comprise an electrically nonconductive substrate, a layer of electrically conductive material disposed a surface of the substrate, and a layer of electrically nonconductive material disposed onto a surface of the conductive material layer. The conductive material layer includes a contact area along a first lengthwise edge of the substrate that is thicker than remaining portions of the material layer. A portion of the substrate adjacent a second lengthwise edge remains exposed. The electrically nonconductive material includes an anti-stick component, and covers the exposed substrate surface and a major portion of the material layer except for the contact area. A first and second sheet is constructed having contact areas along opposite lengthwise edges. The sheets are placed together so that the contact areas are oriented at opposite lengthwise edges, and are staggered so that the contact areas remain exposed. The sheets are wound together in a spiral to form a roll having a contact area at each respective end. Metal is sprayed onto the exposed contact areas to form capacitor electrodes. A thin-film capacitor formed …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.