Structure and process for mounting semiconductor chip
US5737191A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 5, 1996 |
| Grant date | Apr 7, 1998 |
| Priority date | — |
| Expiry date | Apr 5, 2016 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15787
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor chip mount structure includes a substrate having a base surface on which base side connectors are formed; a semiconductor chip mounted on the base surface, the semiconductor chip having chip side connectors on a first surface thereof facing the base surface, the chip side connectors being electrically connected to the base side connectors; an insulating resin layer covering the chip side connectors and the base side connectors; a metal layer, made of a metal having a melting point lower than a temperature at which the electrical components of the semiconductor chip may be thermally destroyed, for covering the semiconductor chip and the insulating resin layer; and a wetting characteristic improving layer such as a metal powder or foil layer, formed along a contact surface between the metal layer and the insulation resin layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.