Resin molded optical assembly
US5737467A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 8, 1995 |
| Grant date | Apr 7, 1998 |
| Priority date | — |
| Expiry date | Dec 8, 2015 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4265
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An optical fiber is held in a ferrule, and then the ferrule is located in a positioning groove formed in a substrate, thereby aligning the optical fiber with an optical device bonded to a surface of the substrate. Then, a lid is placed on the substrate in such a manner that the ferrule is located in a positioning groove formed in the lid and that the optical device is received in a cavity formed in the lid. The ferrule is thus held between the two grooves, and in this condition a resin is filled in the two grooves, thereby retaining the ferrule. Then, the lid is sealingly secured to the substrate. After these parts are thus assembled together, this assembly is put in dies, and then a package is molded.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.