Apparatus and method for removing known good die using hot shear process
US5738267A · kind A · utility
10Cited by
21References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 18, 1996 |
| Grant date | Apr 14, 1998 |
| Priority date | — |
| Expiry date | Oct 18, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/19
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Apparatus and method is provided for separating electrical connections, such as, solder connections, between two surfaces in which electrical connections are relatively weak and thus can be readily separated. The preferred application of the disclosed process and apparatus is its use in separating semiconductor devices from its device carrier after the devices have been through burn-in tests. The unique process and apparatus allows multiple uses of device carrier for testing and/or burning-in devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.