Electroplating process
US5738776A · kind A · utility
10Cited by
7References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 19, 1996 |
| Grant date | Apr 14, 1998 |
| Priority date | — |
| Expiry date | Jan 19, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S205/917
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process for electroplating a metal clad substrate by coating the substrate with a coating of carbonaceous particles. The coating of particles is applied to the substrate from an aqueous dispersion and then the coating is saturated with an etchant for the metal cladding on the substrate to undercut the carbonaceous coating and facilitate its removal from areas where plating is undesired.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.