Process for forming an encapsulated electronic component having an integral resin projection
US5739054A · kind A · utility
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2Claims
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Assignee
Inventor
Key dates
| Filing date | Sep 4, 1996 |
| Grant date | Apr 14, 1998 |
| Priority date | — |
| Expiry date | Sep 4, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4913
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A process for manufacturing an encapsulated electronic part having a resin body and a projecting holding member removably attached to the resin body which may be made of the same resin and formed at the same time as the resin body. The encapsulated electronic part may be conveyed to a test device or to a circuit board and mounted thereon by gripping the holding member with a holding device. The holding member may have a shape conforming to the shape of the holding device and may be separated from the resin body by moving the holding device while holding the resin body stationary.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.